Microencapsulation Shells for MEMS Packaging
Presentation Outline
MEMS Packaging
MEMS Packaging Issues
Proposed Approach
MEMS Encapsulation Processes
Integrated Encapsulation Process
Encapsulation Process (1)
Encapsulation Process (2)
Fabrication/Measurement Results
Wafer Bonding Processes
Drawbacks
Innovative Approach
Rationale: Versatile
Rationale: Localized Heating
Results - Localized Eutectic Bonding
Results - Localized Fusion Bonding
Results - Localized Solder Bonding
Results - Localized CVD Process
Localized CVD Bonding
CVD Bonding Strength
Step Coverage
Bonding Interface
Cross Sectional View
Silicon Etchant Resistance
CVD Bonding for MEMS Packaging
Preliminary Demonstration
Summary
Acknowledgement
Email: lwlin@me.berkeley.edu
Home Page: http://www.me.berkeley.edu/~lwlin