PUBLICATIONS
Liwei Lin

Other Conference or Symposium Presentations

  1. Liwei Lin (Plenary), "MEMS Sensing and Actuating Systems for Human-Machine Interfaces," 2025 Micro-Nano Systems Society Spring Conference (27th Korea MEMS Conference), Jeju, Korea,March 26-28, 2025.
  2. Liwei Lin (Plenary), "Intelligent Sensor/Actuator for Human-Machine Interfaces," 2025 Yonsei Engineering Symposium (YES 2025), Seoul, Korea, March 23-25, 2025.
  3. Liwei Lin (Plenary), "Intelligent Sensor/Actuator for Human-Machine Interfaces," ASME 2024 International Mechanical Engineering Congress and Exposition (IMECE 2024), Portland, Oregon, November 17-21, 2024.
  4. Liwei Lin (Plenary), "Piezoelectric and Piezoelectret Sensors and Actuators," The 11th Asia-Pacific Conference of Transducers and Micro-Nano Technology (APCOT 2024), Singapore, June 23-26, 2024.
  5. Liwei Lin (Keynote), "Coffee Ring Plasmonic Biosensing for Disease Diagnostics," Symposium on Medical-Engineering Collaboration, Tokyo, February 27, 2024.
  6. Liwei Lin (Plenary), "Piezoelectric and Piezoelectret Sensors and Actuators," International Electron Devices & Materials Symposium, Kaohsiung, Taiwan, October 19-20, 2023.
  7. Liwei Lin (Invited), "Intelligent Piezoelectret Sensor/Actuator for Human Machine Interfaces," International Symposium on Intelligent Microsystems, Harbin, China, July 29-30, 2019.
  8. Liwei Lin (Plenary Speaker), "MEMS-based Ultrasonic and Gas Sensors," 2019 International Conference on Smart Sensors, Hsin-Chu, Taiwan, June 3-4, 2019.
  9. Liwei Lin (Keynote Speaker), "Three-dimensional Microelectronics for in situ Monitoring of Milk Spoilage," 2019 International Symposium on Circuits and Systems, Electronics for Better Quality Foods, Sapporo, Japan, May 2019.
  10. Liwei Lin (Invited), "Micro and Nano Fabrication for Advanced Manufacturing," 2018 International Conference on Frontiers of Design and Manufacturing, Jinan, China, August, 2018.
  11. Liwei Lin (Invited), "Laser-Induced Molybdenum Carbide-Graphene Composites for 3D Foldable Paper Electronics," MEMS Manufacturing 2018, Santa Clara, August, 2018.
  12. Liwei Lin (Invited), "Micro/Nano Manufacturing for Sensing and Energy Applications," Microsystems and Nanoengineering Summit 2018, Beijing, China, July 2018.
  13. Liwei Lin (Keynote), "Micro and Nano Manufacturing for Energy Applications," 2018 International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Singapore, April, 2018.
  14. Liwei Lin (Keynote), "Micro and Nano Manufacturing for Sensing and Energy Applications," 2017 International Workshop on Innovation and Commercialization of Micro & Nanotechnology (ICMAN), Chongqing, China, November, 2017.
  15. Liwei Lin (Invited), "Synthesis and Applications of Graphene in MEMS-based Systems," 2017 Midea Global Technology Strategy Symposium, Guangdong, China, May, 2017.
  16. Liwei Lin (Keynote), "Micro and Nano Manufacturing for Sensing and Energy Applications," 2017 World Congress on Micro and Nano Manufacturing, Kaohsiung, Taiwan, March, 2017.
  17. Liwei Lin (Invited), "3D-Printed Microelectronics for Passive Wireless Sensors,"2016 IDTechEx, Santa Clara, November 2016.
  18. Liwei Lin (Invited), "Integrated Functional Nanostructures for Sensing and Energy Applications," 2nd International Conference NanoFIS 2016 - Integrated Functional nano Systems, Graz, Austria, June, 2016.
  19. Liwei Lin (Invited), "Nanostructures for Sensing and Energy Applications," 2015 SITRI-BSAC Commercialization Conference, Shanghai, China, August, 2015.
  20. Liwei Lin (Invited), "New sensor technologies for Smart Cities," Technology, Culture, and Dream Forum for the 30th Year of Postdoc System in Tsinghua University, Shenzhen, China, December, 2015.
  21. Liwei Lin (Invited), "Nano to Macro: Opportunities and Challenges in Scalable Integration," ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (InterPACK2015 & ICNMM2015), San Francisco, July, 2015.
  22. Liwei Lin (Invited), "Nanostructures for Sensing and Energy Applications," The Global Sensor Summit, Wuxi, China, September 24-25, 2014.
  23. Liwei Lin (Keynote), "Highly Responsive Micromachined Piezoelectric Ultrasonic Transducers,"US-Korea Conference (UKC 2014), San Francisco, August, 2014.
  24. Liwei Lin (Invited), "Synthesis and Applications of Graphene in MEMS-based Systems," Microsystems & Nanoengineering Summit 2014, Beijing, August, 2014.
  25. Liwei Lin (Invited), "Micro Mechanical Methods for Biology (M3B)," 2013 Annual Meeting of the Xiamen Microelectromechanical Society Meeting, Xiamen, China, December, 2013.
  26. Liwei Lin (Invited), "Nanostructures for Sensing and Energy Applications," The Third International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M Nano" Suzhou, China, August 26-30, 2013.
  27. Liwei Lin (Invited), "Electrospun Piezoelectric Nanogenerators," 449th conference of XSSC on the frontier of Piezotronice and Nanogenerators, Beijing, China, December, 2012.
  28. Liwei Lin (Invited), "Integration of Nanostructures with Microsystems," 2012 MRS Spring Meeting, San Francisco, April, 2012.
  29. Liwei Lin (Keynote), "MEMS Packaging Challenges and Opportunities," 2012 China Semiconductor Technology International Conference, Shanghai, China, March 18-19, 2012.
  30. Liwei Lin (Invited), "Polymeric Microstructures for Drug-Delivery Applications," International Workshop on Biomedical Micro- and Nanodevices, King Abdullah University of Science and Technology, Saudi Arabia, February 25, 2012.
  31. Liwei Lin (Invited), "Nanogenerator for Electric Clothing," 2nd Nanotoday Conference, Hawaii, Dec. 11-15, 2011.
  32. Liwei Lin (Invited), "Electrospun Nanofibers as Nanogenerators for Electric Clothing," The 4th International Conference on One-dimensional Nanomaterials (ICON 2011), Peking, China, Dec. 7-9, 2011.
  33. Liwei Lin (Keynote), "MEMS Packaging: Challenges and Opportunities," International Workshop on Packaging and System Level Integration of Micro Systems, Bangalore, India, Sep. 29-30, 2011.
  34. Liwei Lin (Invited), "Single Crystal TiO2 Nanoswords for Energy and MEMS Applications," ICMAT 2011, International Conference on Materials and Advanced Technologies, Singapore, June 27-July 1, 2011.
  35. Liwei Lin (Keynote), "Nanostructures for Sensing/Energy Applications and Sensor Development in BSAC," IntelliSense Workshop, Nanjing, China, June 11, 2011.
  36. Jiyoung Chang, Chen Yang, Bin Zhang and Liwei Lin (Invited), "MEMS Performance Challenges - Packaging and Shock Tests," Micro- and Nanotechnology Sensors, Systems, and Applications III, SPIE Defense, Security + Sensing 2011, Orlando, Florida, April, 2011.
  37. Qin Zhou and Liwei Lin, "Direct Synthesis, Assembly and Integration of Graphene via Micro CVD," 2011 NSF CMMI Grantee Conference, January, Atlanta, GA 2011.
  38. Liwei Lin (Invited), "Nanogenerator for Electric Clothing," 2010 International Photonics and Optoelectronics Meetings, Wuhan, China, November 3-5, 2010.
  39. Liwei Lin (Invited), "Nanogenerator for Electric Clothing," 2010 Emerging Information and Technology Conference (EITC), August 23-24, Stanford, USA, 2010.
  40. Liwei Lin (Invited), "Nanogenerator in Electric Clothing for Energy Harvesting," MicroNano 2010, Tokyo, July 28-30, Japan, 2010.
  41. Liwei Lin (Invited), "MEMS Packaging Technologies and Applications," IEEE VLSI-DAT Symposium, Hsin-Chu, Taiwan, April 25-29, 2010.
  42. Liwei Lin (Invited), "MEMS/NEMS Technologies for Information Devices," Proceedings of the 2009 JSME-IIP/ASME-ISPS Joint Conference on Micromechatronics for Information and Precision Equipment (MIPE2009), pp. 5-9, Tsukuba, Japan, June 17-20, 2009.
  43. Liwei Lin (Invited), "Bio Nano Fuel Cells," 2008 Emerging Information and Technology Conference (EITC), June 26-27, Tainan, Taiwan.
  44. Liwei Lin (Invited), "Integration of Nanostructures with Microsystems," ICMAT 2007, International Conference on Materials and Advanced Technologies, Singapore, July 1-6, 2007.
  45. Liwei Lin (Invited) "Bio Nano Fuel Cells," 4th USA-Korea Joint Symposium on MEMS and BioSystems Technology, Berkeley, November 2006.
  46. Liwei Lin (Invited), "Integration of Nanostructures with Microsystems," 2006 International Conference on Nanotechnology and advanced Materials," Hong Kong, Nov. 1-3, 2006.
  47. Liwei Lin (Invited), "Bioelectric PEM Fuel Cells," NSF Workshop: Emerging Opportunities of Nanoscience to Energy Conversion and Storage" Arlington, VI, November 2005.
  48. Liwei Lin (Invited), "Synthesis, Assembly and Integration of Nanowires/Nanotubes," 7th China Micro/Nano Systems Workshop, Dalian, China, August 13-17, 2005.
  49. Liwei Lin (Invited), "Bioelectric PEM Fuel Cells," 3rd Korea-USA Joint Symposium on MEMS and Biosystems Technology, pp. 105-117, KAIST, Daejeon, Korea, June 9-11, 2005.
  50. Liwei Lin, (Invited Keynote), "Synthesis, Assembly and Integration of Nanowires/Nanotubes," Proceedings of the Third Symposium on Intelligent Human Sensing, IHSS2005, pp. 1, March 3, 2005, Toyohashi, Japan.
  51. Liwei Lin and J.C. Chiao, "Integrated Manufacturing for Millimeterwave Sensing Systems," Proceedings of 2005 NSF Design & Manufacturing Research Conference, CD ROM, Scottsdale, Arizona, Jan. 3-6, 2005.
  52. Liwei Lin (Invited), "Bioelectric PEM Fuel Cells," International PEM Fuel Cell Conference, Hsin-Chu, Oct. 14-15, 2004.
  53. Liwei Lin (Invited), "Packaging Issues of MEMS Devices," Converging Technologies: MEMS and Wafer Level Packaging, MEPTEC Q2 Technical Symposium and Exhibits, Santa Clara, CA, May, 2004.
  54. Liwei Lin (Invited), "MEMS Batteries," Electric Power in Vivo Workshop and Symposium, USC, Los Angeles, February, 2004.
  55. Liwei Lin (Invited), "Nano/MEMS Technologies and Their Impacts on Aerospace Future Outlook," Aerospace Forum in Celebration of Human Centennial Power Flight, Tainan, Taiwan, December 22, 2003.
  56. Liwei Lin (Invited), "From MEMS to Nanotechnology," Chinese Institute of Engineers, Mechanics and Material Technology Group Dinner Seminar, Santa Clara, Nov. 7, 2003.
  57. Liwei Lin (Invited), "Thermal Bonding Processes for MEMS Packaging Applications," 2003 TMS Annual Meeting & Exhibition, San Diego, California, March 2-6, 2003.
  58. Liwei Lin (Invited), "Microscale Phase Change Devices," Proceedings of Colloquium on Micro/Nano Thermal Engineering, pp.299-319, Seoul, Korea, Feb. 2003.
  59. Liwei Lin (Invited), "MEMS Packaging by Selective Encapsulations," Thermo-Mechanical Issues in Packaging and Assembly of MEMS and MOEMS Conference, Brugges, Belgium, Nov. 2002.
  60. Liwei Lin (Invited), "Water-Powered Micro Drug Delivery System," 3rd Annual BioMEMS and Nanotech World 2002, Columbus, Ohio, September 6-8, 2002.
  61. Liwei Lin (Invited), "MEMS Research at UC-Berkeley," NATEA/NSC Joint Conference on MEMS and Network Security Santa Clara, September 7, 2002.
  62. Liwei Lin (Invited), "Packaging Issues of MEMS Devices," Pb-free Solder for Electronic, Optical, and MEMS Packaging Manufacturing," Los Angeles, CA, September 5-6, 2002.
  63. Liwei Lin (Invited), "Packaging, Power and Polymer MEMS," 2002 International Microsystem Technology Workshop, Hsin-Chu, Taiwan, July 25-26, 2002.
  64. Liwei Lin (Invited), "Water Powered Bioassay System," Pacific Rim Workshop on Transducers and Micro/Nano Technologies, Xiamen, China, July 22-24, 2002.
  65. Liwei Lin (Keynote), "Microscale Phase Change Devices," 2002 US-Japan Nanotherm Seminar, Nanoscale Thermal Science and Engineering, Berkeley, CA, June 24-26, 2002.
  66. Liwei Lin (Invited), "Plastic Microstructures for Optical and Drug-Delivery Applications," The Golden Gate Polymer Forum, San Jose, May 30, 2002.
  67. Liwei Lin, "MEMS Packaging and Reliability," 2001 ASME International Mechanical Engineering Congress and Exposition, New York, New York, Nov. 2001.
  68. Liwei Lin (Invited), "Vacuum Encapsulation Processes for MEMS Resonators," IMAPS Advanced Technology Workshop on Packaging of MEMS and Related Micro Integrated Nano Systems, Scotts Valley, CA, Nov. 8-10, 2001.
  69. Liwei Lin (Invited), "MEMs Post-Packaging at the Wafer-Level," The PACIFIC RIM/International Intersociety, Electronic Packaging Technical/Business Conference & Exhibition (InterPACK 2001) Kauai, Hawaii, July 8-13, 2001.
  70. L.W. Pan and Liwei Lin, "Flip-Chip Electrical Interconnection by Selective Electroplating and Bonding," Book of Abstracts of Forth International Workshop on High-Aspect-Ratio Microstructure Technology (HARMST'01), pp. 209-210, Baden-Baden, Germany, June 17-19, 2001.
  71. L.W. Pan and Liwei Lin, "Electroplated 3D Microstructure Fabricated by a Step-Height Control Method," Book of Abstracts of Forth International Workshop on High-Aspect-Ratio Mic rostructure Technology (HARMST'01), pp.197-198, Baden-Baden, Germany, June 17-19, 2001.
  72. Li-Wei Pan and Liwei Lin, "Integrated Mesoscopic Electro-Mechanical Manufacturin g via Selective Electroplating and Bonding," Proceedings of 2001 NSF Design & Manufacturing Research Conference, CD ROM, Tampa, Florida, Jan. 7-10, 2001.
  73. Liwei Lin (Invited), "MEMS Packaging at the Wafer-Level," 2000 IMAPS Advanced Technology Workshop on Packaging and Integration of MEMS & Related Microsystems, Orlando, Florida, November 10-12, 2000.
  74. Li-Wei Pan and Liwei Lin, "Integrated Mesoscopic Electro-Mechanical Manufacturing via Electroplating," Proceedings of 2000 NSF Design & Manufacturing Research Conference, CD ROM, paper no. MME-230, Vancouver, Canada, Jan. 3-6, 2000.
  75. Liwei Lin (Invited), "Micro-Science and Tribology," Abstract Book of 46th International Symposium of American Vacuum Society, Oct. 25-29, Seattle, Washington, pp. 141, 1999.
  76. Liwei Lin, "Microencapsulation Shells for MEMS Packaging," Abstract Book of IMAPS Advanced Technology Workshop on Packaging of MEMS Microsystems, Oct. 23-24, Chicago, 1999.
  77. L.W. Pan, Liwei Lin and Jun Ni, "A Flip-Chip LIGA Assembly Technique via Electroplating," Abstract book of HARMST'99, Tokyo, Japan, June 1999.
  78. Liwei Lin, "Integrated Mesoscopic Electro-Mechanical Manufacturing," NIST-NSF Workshop on Manufacturing of Three-Dimensional Structures and Devices at the Meso and Micro Scales, Gaithersburg, Maryland, May 18-19, 1999.
  79. Liwei Lin (Invited), "MEMS Research at MEAM - the University of Michigan," Proceedings of National Important Projects-MOEMS Workshop, Shanghai, China, March 5-7, 1999.
  80. Liwei Lin, "Integrated Mesoscopic Electro-Mechanical Manufacturing," Proceedings of 1999 NSF Design & Manufacturing Grantees Conference, CD ROM, paper no. MME-27, Long Beach, CA, Jan. 5-8, 1999.
  81. Liwei Lin and Yen-Wen Lu, "Structural Analysis of MEMS Pressure Sensors for Disk/Head Interfacial Contact application," Abstract Book of 1998 AFOSR/ONR/NSF Tribology Program Review, June 22-25, Annapolis, MD, 1998.
  82. Liwei Lin, "Tribology Issues in MEMS for Automotive Applications," 1998 SAE International Congress & Exposition, Feb. 22-27, Detroit, 1998.
  83. Liwei Lin, "MEMS Post-Packaging by Localized Heating," Abstract book of IMAPS Advanced Technology Workshop on Sensor Packaging, Ojai, Jan. 1998.
  84. Liwei Lin, "Tribological Effects of Surface Roughness in MEMS Devices," Abstract book of NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS, Columbus, Ohio, Nov. 9-11, 1997.
  85. Liwei Lin, Y.T. Cheng and C.-J. Chiu, "Comparative Study of Hot Embossed Microstructures Fabricated by Laboratory and Commercial Environments," Abstract book of HARMST'97, Madison, June 1997.
  86. Liwei Lin, "Microscale Thermal Bubble Formation: Thermophysical Phenomena and Applications," Workshop on Thermophysical Phenomena in Microscale Sensors, Devices, and Structures, Baltimore, August 1997.
  87. W.H. Lee, Liwei Lin, Y. Cheng and S. Su, "Process Optimization and Characterization for Micro Fresnel Zone Plates", Proceedings of the Photonics/Taiwan '96, Vol. 2, pp. 318-321, Hsin-Chu, Taiwan, 1996.
  88. W.T. Changchien, Liwei Lin, Y.C. Lo and G.O. Chang, "Fabrication of 70.5 and 109.5 Degrees V-Grooves by Anisotropic Etching of Silicon," 1997 Annual Conference of the Chinese Society for Material Science, (in Chinese) pp. F5-9, Tainan, Taiwan, 1997.
  89. C.H. Lin, Liwei Lin, Y.F. Chou and Y.C. Lo, "Fabrication of Hemispherical Shapes by Isotropic Etching of Silicon," 1997 Annual Conference of the Chinese Society for Material Science, (in Chinese) pp. F10-13, Tainan, Taiwan, 1997.

Book & Book Chapters

  1. Yu-Ting Cheng and Liwei Lin, "Soldering by Local Heating," in the book - 3D and Circuit Integration of MEMS Wiley-VCH, ISBN-13: 978-3527346479, 2021
  2. Gaofeng Zheng, Jiaxin Jiang, Huatan Chen, Guoyi Kang, Xiang Wang, Wenwang Li, Liwei Lin, "Electrohydrodynamic Jet Printing - Principles and Applications in High Sensitivity Biosensing," in the book - Materials Science and Technology Wiley-VCH Verlag GmbH & Co., DOI: 10.1002/9783527603978.mst0491, 2020
  3. Ken Saito, Daniel S. Contreras, Isao Mori, Daisuke Tanaka, Satoshi Kawamura, Taisuke Tanaka, Minami Kaneko, Fumio Uchikoba, Yoshio Mita, Liwei Lin and Kristofer S. J. Pister, "Electrostatic Inchworm Motors Driven by High-Voltage Si Photovoltaic Cells for Millimeter Scale Multi-Legged Microrobots," in the book - Advances in Robotics and Automatic control: Reviews, IFSA Publishing, ISBN: 978-84-09-02449-0, 2018.
  4. Yu-Ting Cheng, Yu-Chuan Su, and Liwei Lin, "Localized Sealing Schemes for MEMS Packaging," in the book - MEMS Packaging, World Scientific, ISBN: 978-981-3229-35-8, 2018.
  5. Jiyoung Chang and Liwei Lin, "Piezoelectric Energy Harvesting Nanofibers," RSC, ISBN: 978-1-84973-628-2, 2014.
  6. C.T. Pan, Y.M. Hwang, Liwei Lin and Ying-Chung Chen, "Design and Fabrication of Self-Powered Micro-Harvesters," Wiley, ISBN 978-1-118-48779-2, 269 pages, 2014.
  7. Zhauying Zhou, Zonglin Wang and Liwei Lin (Editors), Microsystems and Nanotechnology, Spinger, ISBN 978-3-642-18292-1, 880 pages, 2012.
  8. Yiin-Kuen Fuh, Firas Sammoura, Yingqi Jiang and Liwei Lin, "Polymeric Microelectromechanical Millimeter Wave Systems," in the book - RF and Microwave Microelectronics Packaging, Springer, ISBN 978-1-4419-0984-8, pp. 43-68, 2010.
  9. Jongbaeg Kim, Yu-Ting Cheng, Mu Chiao and Liwei Lin, "Packaging and Reliability Issues in Micro/Nano Systems," in the book - Handbook or Nanotechnology, 2nd edition Springer-Verlag Berlin Heidelberg, ISBN-10:3-540-29855-X, pp. 1777-1803, 2007.
  10. Y.T. Cheng and Liwei Lin, "MEMS Packaging and Thermal Issues in Reliability," in the book - Handbook or Nanotechnology, Springer-Verlag Berlin Heidelberg, ISBN 3-540-01218-4, pp. 1111-1132, Jan. 2004.
  11. M. Chiao and Liwei Lin, "Sealing Technologies," in the book - MEMS Packaging, The Institution of Electrical Engineers, London, United Kingdom, ISBN 0-86341-335-8, pp. 61-83, Jan. 2004.
  12. Abe Lee, Liwei Lin, et al. (Editors), "Proceedings of Micro-Electro-Mechanical Systems(MEMS)," 1999 ASME International Mechanical Engineering Congress and Exposition , ASME MEMS Vol. 1, ISBN No. 0-7918-1638-9, 1999.
  13. Liwei Lin, et al. (Editors), "Proceedings of Micro-Electro-Mechanical Systems(MEMS)," 1998 ASME International Mechanical Engineering Congress and Exposition , ASME DSC-Vol. 66, ISBN No. 0-7918-1596-X, 1998.
  14. Liwei Lin, et al. (Editors), "Proceedings of Micro-Electro-Mechanical Systems(MEMS)," 1997 ASME International Mechanical Engineering Congress and Exposition, ASME DSC-Vol. 62, HTD-Vol. 354, ISBN No. 0-7918-1843-8, 1997.