MEMS Encapsulation Processes
Integrated MEMS Encapsulation Processes
- Guckel (1984) reactive gas sealing
- Ikeda (1988) epitaxial deposition
- Smith (1996) CMP + film deposition
Wafer Bonding Processes
- Anodic bonding (1969) SOI, pressure sensors ...
- Fusion bonding (??) pressure sensors Ö
- Eutectic bonding (??) assembly, packaging ...